Printing Copper Multilayers with VIAs on 3D Surfaces using Laser Material Processing

Ejvind Olsen

doi:10.51202/9783690300124

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Bibliographic data

Copyright year: 2024
ISBN-Print: 978-3-69030-012-4
ISBN-Online: 978-3-69030-012-4
Publisher: TEWISS, Garbsen
Series: Berichte aus dem ITA
Volume: 04/2024 E-Book
Language: German
Pages: 175
Product type: Book Titles

Titelei/Inhaltsverzeichnis No access Pages I - XVI
1. Introduction No access Pages 1 - 4
1. 2.1. 3D Structural Electronics No access
2. 2.2. Printed Electronics No access
3. 2.3. Laser Material Processing No access
4. 2.4. Conclusion No access
1. 3.1. Multilayer Printing Approach No access
2. 3.2. Sub-goals Specification No access
3. 3.3. Sub-goals Structure No access
1. 4.1. Laser Systems No access
2. 4.2. Copper and Insulator Inks No access
3. 4.3. Sample Preparation No access
1. 5.1. Laser Sintering of Copper Ink No access
2. 5.2. Laser Cleaning of Copper Ink No access
3. 5.3. Laser Ablation of Insulator Ink No access
4. 5.4. Laser System Assessment No access
1. 6.1. 3D Surface Priming with Insulator Ink No access
2. 6.2. 3D Laser Sintering of Copper Ink No access
3. 6.3. 3D Laser Cleaning of Residual Ink No access
4. 6.4. 3D Single-Layer Demonstrators No access
1. 7.1. Resistance Model No access
2. 7.2. Double-Layer VIA Test Design No access
3. 7.3. Process Optimization No access
4. 7.4. Conclusion No access
1. 8.1. 3D Double-Layer Resonator Circuit No access
2. 8.2. 3D Double-Layer LED Circuit No access
3. 8.3. 3D Double-Layer Multidirectional Lighting Circuit No access
4. 8.4. 2D Five-Layer Contact Pad Array No access
9. Conclusion No access Pages 115 - 116
10. Outlook No access Pages 117 - 118
1. A. Mechatronic Integrated Device Geometry Classification Schematics No access
2. B. Multilayer Device Geometry and Technology Nomenclature No access
3. C. Technical Data of Laser Marking Systems No access
4. D. Material Data of the Functional Inks and Pastes No access
5. E. Sintering Parametrization Resistance Measurements No access
6. F. Cleaning Parametrization Depth Measurements No access
7. G. Ablation Parametrization Depth and Width Measurements No access
8. H. Process Development Resistance Measurements No access
9. I. 3D Double-Layer Multidirectional Lighting Circuit No access
List of Figures No access Pages 141 - 143
List of Tables No access Pages 144 - 145
Bibliography No access Pages 146 - 164
Relevant Publications No access Pages 165 - 175